A multitude of cutting-edge chips will leverage TSMC’s 2nm process next year, with the world’s biggest semiconductor manufacturer already having a head start by reportedly taking orders for its wafers from the month of April. For years, the company has relied on Chinese chipmaking equipment to complete its ambitious goals, but with the U.S. administration breathing down its neck, a new report states that TSMC has little choice but to phase out these tools in favor of an alternative.

Full-scale production of 2nm wafers is expected to kick off later this year at TSMC’s Hsinchu plant, followed by the facility located in Kaohsiung. A third plant, which is currently under construction in Arizona, will be utilized to meet future production schedules. According to Nikkei Asia, TSMC’s decision to remove Chinese chipmaking tools is a direct response to the anticipated U.S. regulations like the proposed China EQUIP Act, which essentially prohibits chipmakers from receiving U.S. funding that continue to use equipment supplied by foreign entities that present a concern to national security.

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